Published on: November 21, 2019
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a semiconductor manufacturing process in which a thin film of multiple materials can be deposited on a substrate at low temperature compared to standard chemical vapor deposition (CVD). Semiconductor equipment used for PECVD process are known as PECVD systems. In PECVD process, the deposition is achieved by introducing reactant gases between grounded electrode and RF-energized electrode. Due to the capacitive coupling between the parallel electrodes, the gas is converted into plasma leading to a chemical reaction where the reaction products are deposited on the substrate.
We have categorized the PECVD systems market as a part of the overall semiconductor equipment market. The semiconductor equipment market covers manufacturers of semiconductor equipment, including manufacturers of the raw material and equipment used in the solar power industry.
Increasing demand for electronic devices, growing investments in data centres, increasing demand for power semiconductors, and rising subsidies on procuring PECVD equipment are a few of the reasons that are driving the demand for semiconductor wafers. This, in turn, is creating demand for semiconductor deposition equipment such as semiconductor PECVD equipment from end-users such as foundries, and manufacturers of memory and logic devices.
Moreover, based on geography, the APAC region had the dominant share with more than 50% of the global PECVD systems market. One of the major factors for this region's dominance is the high concentration of foundries, semiconductor wafer manufacturers, semiconductor memory device manufacturers, and IDMs. After APAC, North American region dominates the market owing to the growing investments in autonomous vehicles, 5G networks, AI, smart lighting, electronic warfare equipment, and renewable energy sources which are driving the demand for optoelectronics and power semiconductor devices in the region.
The global PECVD systems market can be segmented into the following:
Many factors are expected to drive growth in the PECVD systems market during the forecast period. Our analysis identifies the following factors to be driving the growth in the PECVD systems market:
Carbon nanotubes are cylindrical structures of carbon atoms and have diameters in the nanometre length scale and have structural lengths of micrometres to centimetres. They have a high mechanical strength, which is many times stronger than steel or other industrial fibres. CNTs are used in composites for structural materials, sports equipment, yachts, armour vests, aerospace components, automotive parts, spark protection, lightning protection, and others. PECVD is one of the most commonly used methods to produce carbon nanotubes.
The investments in the establishment of new fabs or fabrication plants have been on the rise, owing to the increased demand for ICs. The growing demand for ICs is driven by multiple factors, including rising demand from the consumer electronics sector, the growth of Industry 4.0, and growing demand for miniaturized electronic devices. With growing investment in fabs the demand for PECVD systems has increased as they are used for substrate deposition. For instance, Oxford Instruments Plasma Technology announced that Sino-semic has selected Oxford Instruments Plasma Technology’s Cobra plasma etch systems for their manufacturing facilities in Taizhou City.
Acquisition and partnerships help the vendors in product development, geographical expansion, and gaining access to technological expertise. This also enables vendors to explore new opportunity areas for products and services. For instance, Plasma-Therm announced that it has successfully acquired CORIAL, a France-based plasma processing equipment supplier.
Meanwhile, the vendors operating in the market face numerous challenges in increasing their sales and improving profitability. Some of those challenges are:
ALD technology is an advanced deposition technique that is used for the deposition of ultra-thin films of a few nano meters thickness in an extremely precise and controlled manner. A wide range of materials can be used for deposition with ALD, including fluorides, oxides, metals, and sulfides. When compared with other methods such as CVD or PECVD, ALD offers various advantages, including film conformality, low temperature processing, and inherent film quality owing to the self-limiting and self-assembled nature of the ALD mechanism.
The growth of the global semiconductor PECVD equipment market is impeded by the growing demand for refurbished PECVD equipment in the market. This refurbished equipment offers semiconductor manufacturers and laboratories a very cost-effective alternative to investing in new equipment. Previously owned semiconductor deposition equipment can be refurbished at a fraction of the cost of new equipment and can satisfy the end-user's needs for improved performance.
Our reports on the global PECVD systems market cover several large and small vendors active in the market including SENTECH Instruments GmbH, Plasma-Therm LLC, CVD Equipment Corp., NANO-MASTER Inc., and Oxford Instruments Plasma Technology Ltd.
Partnership, acquisitions, and sales through multiple channels are some of the strategies adopted the manufacturers in the global PECVD systems market.
Following are a few of the major developments in the market:
Backed with competitive intelligence and benchmarking, our PECVD systems market research report is designed to provide entry support, customer and M&A assessment, as well as go-to-market strategy support.
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